TECNISCO is doing processing services and can supply customized parts that are manufactured with metal, ceramic, glass, and silicon by its advanced high-precision processes and composite technologies.
TECNISCO's expertise includes: Dicing, Sandblasting, Milling (CNC machining), Assembling (AuSn, AuGe, AgCuIn, AgCu), Polishing, Bonding, Metallization (Plating, Sputtering, Vapor deposition) for producing such as CuW, CuMoCu, CuAlNCu, Cu heatsinks (for High power laser diode ), and Structured glass wafer (for MEMS and Medical device).